The CENTURIA-E product range for back grinding of wafers allows to reach highest quality surfaces with a significantly improved die strength ratio. The composition of optimised diamond quality, special bond system and an unique core design manufactured with an innovative production method at Asahi, guarantees lowest grinding forces during the grinding process. In combination with specific process adjustments an outstanding economic efficiency can be reached.
Features
Improved die strength ratio thanks to the smallest grit size (1 μ), optimised diamond quality and specific bond system
Higher removal rates and shorter grinding cycles thanks to outstanding diamond quality
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