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front-view of the product Grinding tools in BY systems for the machining of hypodermic needles

detail-view of the product Grinding tools in BY systems for the machining of hypodermic needles

isometric-view of the product Grinding tools in BY systems for the machining of hypodermic needles

front-view of the product Grinding tools in BY systems for the machining of hypodermic needles

detail-view of the product Grinding tools in BY systems for the machining of hypodermic needles

isometric-view of the product Grinding tools in BY systems for the machining of hypodermic needles

Grinding tools in BY systems for the machining of hypodermic needles

Silicon carbide grinding tools in self-sharpening resinoid bond systems.

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Product information

Features

Burr-free finish
Long lifetime
Best surface finishes

Abrasive Grain

Conventional (A+C)

Bond Classification

Resin

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Brochure

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English (US)

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