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front-view of the product File lappers resin bonded

front-view of the product File lappers resin bonded

Lappers resin-bonded

for tungsten carbide

For very hard materials
High quality diamond grit

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Product variants

Shape
Dimensions
Specification

Shape
Type number
Dimensions
Mounting
Specification
Delivery unit

90 H

95717
150
25 - 10 - 2
11D 39 C50 B 52 AL
1

91963
150
40 - 10 - 2
11D 39 C50 B 52 AL
1

Product information

Description

The resin-bonded lappers are primarily used for deburring and lapping extremely hard materials. They are therefore the common choice for whetting tungsten carbide cutting edges. This product is only available in a diamond grain design with a grit size of D35.

Applications

For deburring and lapping very hard materials, primarily for trueing carbide cutting edges

Abrasive Grain

Diamond (D)

Bond Classification

Resin

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