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SKYTEC BOLT

The metal-bonded diamond grinding tool for the PowerGrind process

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Product information

Features

  • Low grinding forces:

    The individually adapted specification for the grinding wheel and ongoing conditioning reduce the grinding forces.

  • Minimal chipping:

    The use of small grit sizes leads to a significant reduction in cutting edge chipping, with constant economic efficiency.

  • Shorter grinding time:

    Specially adapted diamond grains and the newly developed metal bond in combination with the PowerGrind process enable you to reduce grinding time by up to 50%.

Abrasive Grain

  • Diamond (D)

Bond Classification

Metal

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Flyer

  • PDF
  • English (US)

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