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SKYTEC BOLT

The metal-bonded diamond grinding tool for the PowerGrind process

Ceramic
Ceramic
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Specification

Technical Data

Abrasive grainDiamond (D)
MaterialienCeramic

Features

Low grinding forcesThe individually adapted specification for the grinding wheel and ongoing conditioning reduce the grinding forces.
Minimal chippingThe use of small grit sizes leads to a significant reduction in cutting edge chipping, with constant economic efficiency.
Shorter grinding timeSpecially adapted diamond grains and the newly developed metal bond in combination with the PowerGrind process enable you to reduce grinding time by up to 50%.

Description

The innovative SKYTEC BOLT metal bond was specially developed for the patented Agathon PowerGrind process. Spark erosion enables the grinding wheel to be continuously and simultaneously dressed, sharpened and cleaned during the grinding process. The maximum chipping space and the permanent, easy cutting grinding wheel topography of the SKYTEC BOLT enable tool inserts to be machined with maximum economic efficiency.

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