Specification
Description
Latest diamond qualities, maximum grain volume and adapted bond systems characterise the new SKYTEC XD-2 product line. The grinding tools impress with an extremely high removal rate, at the same time reduced wear and optimal chipped edges on the ground workpiece.
Technical Data
- Abrasive grain
- Diamond (D)
- Materials
- Steel
Features
- Highest Lifetime—Long service life and thus shortened non-productive process times are achieved by a strong bonding strength of the diamond grain in ceramic bond.
- High cutting-edge quality—Due to the special combination of diamond and bond content the high quality requirements in PKD/ PCBN machining can be fulfilled optimally.
- Reduced grinding times—New diamond qualities in combination with the stronger bond system leads to increased stock removal rates and short grinding cycles.


